导航菜单

中文信息

(1) Siyang Liu, Xin Tong, Jiaxing Wei, Weifeng Sun, “Single-pulse Avalanche Failure Investigations of Si-SJ-MOSFET and SiC-MOSFET by Step-control Infrared Thermography Method”, IEEE Trans. on Power Electronics, 2020, 35(5), pp.5180-5189.

(2) Siyang Liu, Xin Tong, Jiaxing Wei, Weifeng Sun, “Lightning Surge Robustness Analysis and Optimization for an LED Driver Based on a Flyback Converter”, IEEE Trans. on Industrial Electronics, 2020, DOI:10.1109/TIE.2020.3031537.

(3) Siyang Liu, Sheng Li , Chi Zhang, Ningbo Li, Xinyi Tao, Weifeng Sun, “Single Pulse Unclamped-Inductive-Switching Induced Failure and Analysis for 650V p-GaN HEMT”, IEEE Trans. on Power Electronics, 2020, 35(11), pp.11328-11331.

(4) Siyang Liu, Lu Li, Ran Ye, Haibo Wu, Wangran Wu, Weifeng Sun, Shulang Ma, Boyong He, Wei Su, “Hot-carrier-induced Degradation and Optimization for 700V High-voltage Lateral DMOS by the AC Stress”, IEEE Trans. on Electron Devices, 2020, 67(3), pp.1090-1097.

(5) Siyang Liu, Hanqi Yang, Zhichao Li, Weifeng Sun, “Switch-OFF Avalanche Breakdown Induced Electrical Degradations of RF-LDMOS Transistor for SMPAs Applications”, IEEE Trans. on Electron Devices, 2018, 65(10), pp. 4719-4723.

(6) Siyang Liu, Ran Ye, Weifeng Sun, Longxing Shi, “A Novel Lateral DMOS Transistor With H-Shape Shallow-Trench-Isolation Structure”, IEEE Trans. on Electron Devices, 2018, 65(11), pp. 5218-5221.

(7) Siyang Liu, Chao Yang, Weifeng Sun, Qingsong Qian, Yu Huang, Xing Wu, Litao Sun, “Repetitive-avalanche-induced Electrical Parameters Shift for 4H-SiC Junction Barrier Schottky Diode”, IEEE Trans. on Electron Devices, 2017, 64(8), pp. 3275-3281.

(8) Siyang Liu, Weifeng Sun, Qinsong Qian, Jiaxing Wei, Fang Jiong, Li Ting, Zhang Chi, Shi Longxing, “A Review on Hot-Carrier-Induced Degradation of Lateral DMOS Transistor”, IEEE Trans. on Device and Materials Reliability, 2018, 18(2), pp.298-312.

(9) Siyang Liu, Chunwei Zhang, Kaikai Xu, Weifeng Sun, “Hot-Carrier-Induced Degradations Investigations for 600V IGBT by an Improved Charge Pumping Solution”, IEEE Trans. on Electron Devices, 2017, 64(2), pp. 634-637.

(10) Siyang Liu, Sheng Li, Zhichao Li, Weifeng Sun, Wei Su, Shulang Ma, Feng Lin, Yuwei Liu, Guipeng Sun, “Lateral DMOS with Partial-Resist-Implanted Drift Region for Alleviating Hot-Carrier Effect”, IEEE Trans. on Device and Materials Reliability, 2017, 17(4), pp.780-784.

(11) Siyang Liu, Ran Ye, Weifeng Sun, Chunwei Zhang, Jiaxing Wei, Wei Su, Aijun Zhang, Shulang Ma, “Electrical Parameters Degradations and Optimizations of SOI-LIGBT Under Repetitive Unclamped Inductive Switching Conditions”, IEEE Trans. on Electron Devices, 2016, 63(4), pp.1644-1649.

(12) Siyang Liu, Chunde Gu, Jiaxing Wei, Qinsong Qian, Weifeng Sun, Alex Q. Huang, “Repetitive Unclamped-Inductive-Switching-Induced Electrical Parameters Degradations and Simulation Optimizations for 4H-SiC MOSFETs”,IEEE Trans. on Electron Devices, 2016, 63(11), pp.4331-4338.

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